PURPOSE: To improve moisture resistance and to prevent ions in pretreating solution from impregnating by closing a gap between leads and a resin molding layer by an aerobic adhesive, dipping an enclosure in the adhesive to cure it before sheathing the exposed portion of the leads, and removing the uncured portion, thereby preventing water from impregnating from the exterior.

CONSTITUTION: The reason why an aerobic adhesive is used is because, if the leads of a resin-sealed semiconductor device are coated with cured adhesive layer, a conduction cannot be obtained in case of mounting on a printed circuit board, it is prevented. A cured layer 6 of the adhesive is formed in a gap be tween the layer 5 and leads 3, the gap is closed, and the other structure is similar to the conventional one. In other words, a semiconductor die bonded to the bed 1 and a chip 2 are sealed in the layer 5, and a wire bonding is performed between a semiconductor chip and the leads 3.