Title:
RESIN SEALED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP3677661
Kind Code:
B2
Abstract:
PURPOSE: To enable a resin sealing member to be formed at lower molding temperature than that of an organic material by using the organic material for a carrier board.
CONSTITUTION: Within the title resin sealed semiconductor device wherein exceeding one each of semiconductor elements 11 are mounted on a mounting surface of a carrier board 14 and respective semiconductor elements 11 electrically connected are covered with a resin sealing material 13 while the carrier board 14 is formed of an organic material in low dielectric constant and the resin sealing material 13 is formed of a material capable of molding at a molding temperature lower than the glass transition temperature of the organic material. Through these procedures, the connection reliability in packaging step can be improved while cutting down the warpage of the carrier board 14 after resin sealing step.
Inventors:
Akira Nagai
Eguchi State
Masanori Segawa
Toshiaki Ishii
Hiroyoshi Kosumi
Masahiko Ogino
Ryo Mogi
Eguchi State
Masanori Segawa
Toshiaki Ishii
Hiroyoshi Kosumi
Masahiko Ogino
Ryo Mogi
Application Number:
JP21443794A
Publication Date:
August 03, 2005
Filing Date:
September 08, 1994
Export Citation:
Assignee:
Renesas Technology Corp.
International Classes:
H01L23/28; H01L21/56; H01L23/10; H01L23/14; H01L23/29; H01L23/31; (IPC1-7): H01L23/14; H01L21/56
Domestic Patent References:
| JP855867A |
Attorney, Agent or Firm:
Hirotsugu Yoshioka