PURPOSE: To perform resin sealing of a semiconductor device having high reliability and favorable productivity by a method wherein a compound formed by adding novolak type phenol resin hardener, organic phosphine hardening accelerator, sorbitol ester, and inorganic filler to novolak type epoxy resin having the prescribed epoxy equivalent is used.
CONSTITUTION: Novolak type phenol novolak resin, etc., having 3% or less of resin compound being soluble in water at the normal temperature and having 60W100°C softening point is used as the hardener for phenol novolak type epoxy resin, etc., having the 170W300 epoxy equivalent, and the compounding ratio is suppressed within 0.5W1.5 of the numeral ratio of phenolhydroxyl group and epoxy group. Moreover triphenylphosphine is added by about 0.01W10wt% of resin to accelerate hardening. Then sorbian monolaurate is added by 0.01W 10wt% of resin and quartz glass powder is added by about 1.5W4wt% of resin, and mixing treatment and molding are performed to make it to be hardened at 150°C or more. When resin sealing is performed by this constitution, superior resistivity to high temperature and to high humidity can be obtained.
HATANAKA AYAKO
SUZUKI SHIYUICHI
WADA MORIKIYOU
