PURPOSE: To provide excellent moisture resistance in a resin-sealed semiconductor device by drawing tab leads for holding die pads of a lead frame approximately from the center of the side of the pad formed in a rectangular shape.
CONSTITUTION: Tab leads 8 for holding die pads are provided to be secured to a lead holding plate 5 formed substantially at the center of the long side of the pad. Tab leads 2 are not provided at the short side of the pad, the end is completely sealed with resin, shielded from the exterior, and not connected to the exterior even if a separation occurs therein, thereby obtaining a moisture resistance. Since a stress occurred at the center of the long side is small and the separation occurs less, the moisture resistance can be improved.
NAKAGAWA OSAMU
FUKUSHIMA JIROU
| JPS5844756A | 1983-03-15 |
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