Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN-SEALED SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS6323343
Kind Code:
A
Abstract:

PURPOSE: To facilitate the layout of lead arrangement and improve a moisture resistance by providing a tab hanging member partially exposed outside a resin- sealed body from a position deviated from a tab.

CONSTITUTION: A resin sealed semiconductor device has such a structure that a tab extension 10 is formed which laterally extends along a frame 6 in a reverse direction to the one wherein a plurality of leads 3a and 3b are led out from a tab 1 and has a sufficient area and the tab extension 10 is connected with the frame 6 via a tab hanging member 11 located in a position deviated from a tab 1 to which a semiconductor pellet 12 is mounted. Although most of the tab extension 10 is formed inside a resin-sealed body 8, part of the tab hanging member 11 is exposed out of the resin-sealed body 8. Leading out tab leads in a reverse direction to those of a plurality of the leads facilitates the layout of the leads that become IC pins and improves a freedom in selecting the configuration of a lead frame and the number of the pins.


Inventors:
Shimizu, Kazuo
Hoya, Kazuo
Inoue, Fumihito
Application Number:
JP1987000029606
Publication Date:
January 30, 1988
Filing Date:
February 13, 1987
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI LTD
International Classes:
H01L23/48; H01L23/28; H01L23/50; (IPC1-7): H01L23/28; H01L23/48
Domestic Patent References:
JPS54159178A
JPS5367786A