Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN SEALED TYPE LIGHT EMITTING DEVICE
Document Type and Number:
Japanese Patent JPS59175173
Kind Code:
A
Abstract:
PURPOSE:To make the characteristic of photo output excellent by reducing the internal stress by a method wherein terminal dihydroxypolyester whose molecular weight is 3,000-50,000 and 1,8-diaza-bicyclo-undecene-7 are added to epoxy resin. CONSTITUTION:In order to reduce the internal stress and make the characteristic of photo output excellent without decreasing the thermal deformation temperature and the photo transmittance of the sealed resin, a light emitting element is sealed with the epoxy resin composition consisting of the 100 superposition of epoxy resin, 5-30 superposition of terminal dihydroxypolyester which is soluble to said resin and has the molecular weight of 3,000-50,000, 50-150 superposition of anhydride hardener, and 0.1-10 superposition of 1,8-diaza-bicyclo (5, 4, 0) undecene-7 or at least one kind of compound selected out of its salts as a hardening promotor. Thereby, the workability based on the compatibility with said resin, dispersion property, and viscosity characteristic and the thermal deformation temperature for the hardened substance is optimized.

Inventors:
MATSUMOTO KAZUTAKA
YOSHIZUMI AKIRA
Application Number:
JP4874483A
Publication Date:
October 03, 1984
Filing Date:
March 25, 1983
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOSHIBA KK
International Classes:
C08G59/00; C08G59/40; C08L63/00; C08L67/00; H01L23/29; H01L23/31; H01L33/56; (IPC1-7): C08G59/42; C08G59/50; H01L23/30; H01L33/00
Attorney, Agent or Firm:
Noriyuki Noriyuki



 
Previous Patent: PHOTOCOUPLER DEVICE

Next Patent: LIGHT EMITTING DIODE ARRAY