Title:
RESIN-SEALED TYPE OPTICAL MODULE
Document Type and Number:
Japanese Patent JP2002189150
Kind Code:
A
Abstract:
To provide a mounting structure of optical passive parts in which the optical characteristics do not vary even when a resin-sealing is used.
The optical passive parts 2 is mounted on an optical bench 1. A first metallic pattern 1b is formed on the mounting plane of the optical bench. A metallic pattern 2b for soldering is formed on the mounting plane of the optical passive parts 2. The planar shape and the sectional area of the metallic pattern 2b for soldering are substantially identical with the planar shape and the sectional area of the metallic pattern 1b, respectively.
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Inventors:
SAWAI AKIYOSHI
Application Number:
JP2000390272A
Publication Date:
July 05, 2002
Filing Date:
December 22, 2000
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G02B6/42; H01L21/60; H01L23/12; H01L23/28; H01L25/16; H01L31/02; H01S5/022; (IPC1-7): G02B6/42; H01L21/60; H01L23/12; H01L23/28; H01L25/16; H01L31/02; H01S5/022
Attorney, Agent or Firm:
Hisami Fukami (4 outside)