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Patent Searching and Data


Title:
RESIN SEALED TYPE SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0247857
Kind Code:
A
Abstract:

PURPOSE: To prevent a semiconductor element from cracking and wiring from being damaged by forming a cavity in a region opposite to the element surface of the semiconductor element in resin to seal the semiconductor element.

CONSTITUTION: A semiconductor element 1 is mounted on the element mounting part 2a of a lead frame 2 and the electrode pad and the inner leads 2b of the lead frame 2 are connected to each other with metallic fine lines 3. The semiconductor element 1, the inner leads 2b, and the metallic fine wires 3 are sealed by molding with resin 4 to make a package and outer leads 2c are protruded on the side faces of the resin 4. A cavity 5 is formed in a region opposite to the element surface of the semiconductor element 1 in the resin 4 to prevent the element surface from coming into contact with the resin 4. This prevents the semiconductor element 1 from cracking and fine wiring from being damaged even if a rapid change of a temperature in packaging or other processings generates thermal stress by the difference in thermal expansion coefficient between silicon constructing the semiconductor element 1 and the resin 4, therefore, the reliability of a semiconductor device can be improved.


Inventors:
CHIBA FUMITAKA
Application Number:
JP1988000199204
Publication Date:
February 16, 1990
Filing Date:
August 10, 1988
Export Citation:
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Assignee:
NEC CORP
International Classes:
H01L23/28; (IPC1-7): H01L23/28
Domestic Patent References:
JPS6315448A1988-01-22
JPS62185346A1987-08-13
JPS62113433A1987-05-25
JP1113348B