Title:
RESIN SEALED TYPE SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JPH0582671
Kind Code:
A
Abstract:
PURPOSE: To radiate heat generation of a semiconductor chip via a lead and improve reliability.
CONSTITUTION: In a resin sealed type semiconductor element, a ceramic 5 made of an intense heat conductive material is adhered and fixed with a brazing material 6 between an island 11a for adhering a semiconductor chip 2 and a lead 1b opposing to this island 11a.
Inventors:
SAITO TADAYOSHI
Application Number:
JP23851691A
Publication Date:
April 02, 1993
Filing Date:
September 19, 1991
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L23/28; H01L23/34; H01L23/36; (IPC1-7): H01L23/28; H01L23/34; H01L23/36
Attorney, Agent or Firm:
Uchihara Shin