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Title:
RESIN SEALING APPARATUS
Document Type and Number:
Japanese Patent JP3919293
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To improve cleanliness by providing a replaceable mask of a sandwiching surface for sandwiching a material to be molded of a lower mold from a resin sealing operation to a cleaning operation, thereby further enhancing a cleaning effect of the mold.
SOLUTION: A mask material 12 masks a sandwiching surface of a lower mold cavity insert for placing to sandwich a base plate 10 of the lower mold 2. As the material 12, a metal thin plate such as a copper plate is, for example, used. The material 12 is close-contably disposed to mask the surface of the mold 2 when the material 12 is fed from a feeding reel 13 and passed between upper and lower molds 1 and 2, and taken up on a take-up reel 14. The material 12 is brought into close contact with or separated from the mold 2 by height moving movable tension rollers 15, 16. The material 12 is replaced by driving the reel 14 side before next resin sealing operation after cleaning of the upper and lower molds by a cleaner 11 and by taking up a length of the material 12 for one to seal the resin resing sealing and setting a new mask surface onto the mold 2.


Inventors:
Toshiaki Kitagawa
Application Number:
JP16702397A
Publication Date:
May 23, 2007
Filing Date:
June 24, 1997
Export Citation:
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Assignee:
Apic Yamada Corporation
International Classes:
B29C33/72; B29C45/02; B29C45/14; B29C45/26; B29C45/76; H01L21/56; B29L31/34; (IPC1-7): B29C33/72; B29C45/02; B29C45/26; B29C45/76; H01L21/56; //B29L31:34
Domestic Patent References:
JP9117921A
JP8250533A
JP63246218A
JP10270476A
JP61140815U
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu