Title:
RESIN-SEALING DEVICE FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3929218
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To recover a sealing resin with efficiency in a resin-sealing device utilizing screen printing.
SOLUTION: A resin-sealing device for an electronic component is provided with a rotator having a sealing resin supply squeezee and a sealing resin finishing squeezee, a sealing resin recovered by the sealing resin finishing squeezee is recovered by the sealing resin supply squeezee.
Inventors:
Masatoshi Okuno
Kaoru Yoda
Kaoru Yoda
Application Number:
JP2000009650A
Publication Date:
June 13, 2007
Filing Date:
January 19, 2000
Export Citation:
Assignee:
Citizen Miyota Co., Ltd.
International Classes:
B41F15/44; H01L21/56; (IPC1-7): H01L21/56; //B41F15/44
Domestic Patent References:
| JP8116166A | ||||
| JP5024175A | ||||
| JP6039999A | ||||
| JP3581622B2 |
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