Title:
RESIN SEALING DEVICE AND RESIN SEALING METHOD
Document Type and Number:
Japanese Patent JP2023072436
Kind Code:
A
Abstract:
To provide a resin sealing device and a resin sealing method which have high reliability.SOLUTION: A resin sealing device (1) includes: a first loader hand (61) which enters a resin sealing mold (21) in a state of holding workpiece (W), and delivers the workpiece (W) to a lower mold (22); a film supply part (27) for supplying a film (F) to a molding surface of an upper mold (23); and an opening mechanism (61B) for forming a through hole (T) in a part adsorbed to a bottom surface of a cavity (25) in the film (F) adsorbed to the molding surface by suction from a suction hole (23G), wherein the opening mechanism (61B) is provided on the first loader hand (61).SELECTED DRAWING: Figure 4
Inventors:
TAGAMI SHUSAKU
YANAGISAWA MAKOTO
YANAGISAWA MAKOTO
Application Number:
JP2021184994A
Publication Date:
May 24, 2023
Filing Date:
November 12, 2021
Export Citation:
Assignee:
APIC YAMADA CORP
International Classes:
H01L21/56; B29C43/18; B29C43/34
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Koichi Sawai
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Koichi Sawai