To provide a resin sealing device for a semiconductor element, which performs the cleaning and the like of a mold under a condition that an ejector pin is not projected into a cavity.

The resin sealing device for a semiconductor element is provided with a top force as well as a bottom tool for resin-molding the semiconductor element and the ejector pin for releasing the semiconductor element molded by a resin from the molds and taking out the same. A stopper inserted between an upper plate, to which the ejector pin is fixed, and the top force to retain the position of the ejector pin, and a means for inserting the stopper between the upper plate and the top force are provided to received and retain the ejector pin in the top force.