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Patent Searching and Data


Title:
RESIN SEALING DEVICE
Document Type and Number:
Japanese Patent JP2007149895
Kind Code:
A
Abstract:

To provide a resin sealing device which suppresses a quantity of resin that becomes unnecessary after sealing of resin.

The resin sealing device is provided with a second mold 6, and a first mold 34 which is attachable or detachable to the second mold 6, and a top-view square cavity formed by the molds 6 and 34 is filled with resin melted in a pot 21 by means of a gate, thereby insert-molding an insert article 23 fitted in both molds. The pot 21 is provided in either of the molds 6 and 34, and it is formed of recesses 38 with an oblong opening that are adjacent to each other at specified spacing on one side of the cavity. In addition, the bottom of the recess 38 is made movable to the opening by a plunger 10. The gate 39 is arranged in a manner to connect one side of the cavity and the long side of the pot 21.


Inventors:
OGATA KENJI
Application Number:
JP2005341180A
Publication Date:
June 14, 2007
Filing Date:
November 25, 2005
Export Citation:
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Assignee:
DAI ICHI SEIKO CO LTD
International Classes:
H01L21/56; B29C45/02; B29C45/14; B29C45/27; B29L31/34
Attorney, Agent or Firm:
Hiroshi Yamazaki
Atsushi Maeda
Takanobu Nakajima