Title:
樹脂封止装置
Document Type and Number:
Japanese Patent JP7393795
Kind Code:
B2
Abstract:
To provide a resin encapsulation device capable of collectively replacing a plurality of containers that discharge a liquid resin.SOLUTION: A resin encapsulation device 1 for encapsulating a workpiece with a resin is provided with a resin feeding module 2 for feeding a liquid resin to a plurality of pots 64 provided on a mold 60 of a press module 6 for sandwiching and pressing a workpiece to mold, from the same number of resin feeding ports 54. The resin feeding module 2 is provided with: a collectively replaceable container unit 40; and a pipeline member 50 for feeding the liquid resin from the container unit 40 to the resin feeding ports 54. The container unit 40 is provided with: a plurality of containers 44 capable of discharging the liquid resin; and a holder 43 for holding the plurality of containers. The container unit 40 can collectively connect the pipeline member 50 to each of the discharge ports 45 of the plurality of containers 44, and can collectively disconnect it.SELECTED DRAWING: Figure 8
Inventors:
▲高▼山 凌
Takayuki Yanagisawa
Tatsushi Oguchi
Youhei Sato
Yoshiaki Nishizawa
Naoya Goto
Takayuki Yanagisawa
Tatsushi Oguchi
Youhei Sato
Yoshiaki Nishizawa
Naoya Goto
Application Number:
JP2020151469A
Publication Date:
December 07, 2023
Filing Date:
September 09, 2020
Export Citation:
Assignee:
Apic Yamada Co., Ltd.
International Classes:
B29C31/04; B29C45/02; B29C45/18; H01L21/56
Domestic Patent References:
| JP2012101517A | ||||
| JP201076146A | ||||
| JP2006103799A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Koichi Sawai
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Koichi Sawai