Title:
RESIN SEALING METHOD AND APPARATUS
Document Type and Number:
Japanese Patent JP2001079878
Kind Code:
A
Abstract:
To provide a resin sealing method capable of uniformly controlling the quantity and pressure of a resin at the time of sealing of a semiconductor device with a resin.
A process for clamping the periphery of an article 1 to be molded through a release film 9 and feeding a seal resin 6 to a cavity 5 from a pot 7 under pressure through the resin route connecting the pot 7 and the cavity 5 and a process for contracting the vol. of the cavity 5 so as to allow the seal resin 6 to overflow from the cavity 5 to clamp the article 1 to be molded to form a molded article having predetefrmined resin thickness are provided.
Inventors:
MIYAJIMA FUMIO
Application Number:
JP26047399A
Publication Date:
March 27, 2001
Filing Date:
September 14, 1999
Export Citation:
Assignee:
APIC YAMADA CORP
International Classes:
H01L21/56; B29C33/68; B29C45/02; B29C45/14; B29C45/56; B29C45/26; (IPC1-7): B29C45/14; B29C33/68; H01L21/56
Attorney, Agent or Firm:
Takao Watanuki (1 outside)
Previous Patent: MULTICOLOR/MULTI-MATERIAL MOLDING MACHINE
Next Patent: INSERT MOLDING METHOD FOR PARTIALLY LAMINATED SKIN MATERIAL
Next Patent: INSERT MOLDING METHOD FOR PARTIALLY LAMINATED SKIN MATERIAL