Title:
RESIN SEALING METHOD FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3292923
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin sealing method for an electronic component in which occurrence of unfilled part in the resin layer of an electronic component can be prevented easily.
SOLUTION: The resin sealing method for an electronic component comprises a step for printing in vacuum environment while filling with resin 23 via the holes of a stencil 26 through action of a squeegee 17 and forming an oversupply resin layer 23a on the stencil 26, a step for pushing a part of resin in the oversupply resin layer through the stencil utilizing the difference of atmospheric pressure at the time of returning from the vacuum environment back to the atmospheric environment, and a step for removing the oversupply resin layer remaining on the stencil 26 after resin is filled utilizing the difference of atmospheric pressure.
Inventors:
Atsushi Okuno
Koichirō Nagai
Noritaka Ohyama
Koichirō Nagai
Noritaka Ohyama
Application Number:
JP30986899A
Publication Date:
June 17, 2002
Filing Date:
October 29, 1999
Export Citation:
Assignee:
Sanyu Rec Co., Ltd.
International Classes:
H05K3/28; H01L21/56; (IPC1-7): H01L21/56; H05K3/28
Domestic Patent References:
| JP1140590A | ||||
| JP5114620A | ||||
| JP1140591A | ||||
| JP11233536A | ||||
| JP11297902A | ||||
| JP2000226526A | ||||
| JP2000228410A |
Attorney, Agent or Firm:
Eiji Saegusa (8 others)
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