Title:
RESIN SEALING METHOD FOR ELECTRONIC PART AND DEVICE THEREOF
Document Type and Number:
Japanese Patent JPS5821345
Kind Code:
A
Abstract:
PURPOSE:To reduce a resin sealing time by a method wherein rubber materials with built-in electronic parts loaded in stages in a magazine stocker are carried one by one into independent cavities provided on a lower metal mold, and resin material pellets are supplied thereinto simultaneously being heated and then collectively pressed by independent plungers projected on the lower surface of the upper metal mold. CONSTITUTION:The rubber materials 5 with buit-in electronic parts are loaded in stages in the magazine stocker 19 and arranged one by one onto a pre-heat rail 23 with a built-in heater 24 by using a lead-out pin 22. Next, this rail 23 is moved, the rubber materials 5 are dropped into independent cavities provided on the lower metal mold 17 likewise with a built-in heater 24', and resin material pellets 18 in a hopper 35 are supplied thereinto thus being fused. Thereafter, they are pressed by an independent plurality plungers 9 on the lower surface of the upper metal mold 6 operated by a cylinder 30, and the peryphery of the rubber materials 5 is resin-sealed. Next, it is transferred into a rail 33 and exhausted out by using a chucking device 32.
Inventors:
OMOTO HISAKAZU
KAMIKUBO AKIRA
KAWABATA AKIRA
TAKI YASUO
YAMAMOTO KATSUYUKI
KAMIKUBO AKIRA
KAWABATA AKIRA
TAKI YASUO
YAMAMOTO KATSUYUKI
Application Number:
JP11989981A
Publication Date:
February 08, 1983
Filing Date:
July 29, 1981
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B29C45/00; B29C31/00; B29C31/04; B29C35/00; B29C43/18; B29C45/14; H01L21/56; (IPC1-7): B29D3/00; H01L21/56
Domestic Patent References:
| JPS5611236A | 1981-02-04 | |||
| JPS5630841A | 1981-03-28 | |||
| JPS5330228A | 1978-03-22 | |||
| JPS5546678U | 1980-03-27 | |||
| JPS4517377Y1 | 1970-07-17 | |||
| JPS5132208U | 1976-03-09 |
Attorney, Agent or Firm:
Shigetaka Awano (1 person outside)