Title:
RESIN SEALING METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS54154971
Kind Code:
A
Abstract:
PURPOSE:To avoid contamination of the metal mold when the continuous forming is given as well as to enable use of the resin of reduced amount of the parting agent by providing the dummy cavity which is connected to the main cavity via the 2nd gate. CONSTITUTION:The contamination of the metal mold is not caused easily at runner 1 where the resin flows and at the cavity of the gate 2 side, and caused easily at the cavity of the side of air vent 4 where the resin flow is stopped. In this connection, dummy cavity 10 connecting to the semiconductor device sealing cavity is provided in addition to the sealing cavity, and the dummy cavity is used for main cavity 3. At the same time, the fact that the parting agent oozes out much to the resin surface at the area where the resin flows can be utilized, and also a large amount of the parting agent oozes out onto the metal mold surface of cavity 3 even with use of the reain featuring small amount of the parting agent. As a result, the parting performance is improved to obtain a molded part featuring a large adhesive force with the lead frame and a high anti-moisture property.
Inventors:
TANAKA GOROU
SUZUKI HIROSHI
SUZUKI HIROSHI
Application Number:
JP6328878A
Publication Date:
December 06, 1979
Filing Date:
May 29, 1978
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/56; B29C43/00; B29C45/00; B29C45/02; B29C45/14; B29C45/26; (IPC1-7): B29G3/00; H01L21/56