Title:
RESIN-SEALING METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS61117844
Kind Code:
A
Abstract:
PURPOSE:To seal the titled device with resin by reduction in wasteful time by a method wherein a molding die is heated by a presser in a short time by pre-heating this die before putting it on the presser fixedly. CONSTITUTION:The lower die 1 is provided with cavities 11 in multiarray form. Resin from a sprue 14 is cast into the cavities 11, and semiconductor devices placed in the cavities 11 are sealed with resin. Two lower dies 1 are put on a heater 7 fixedly and pre-heated: the right one is used for a next resin sealing, and the left one for the next resin sealing. Therefore, the successive exchange of dies to be pre-heated is facilitated. Since dies are thus pre-heated by another heater, the time of heating on a presser in resin sealing is markedly reduced. Accordingly, wasteful times are shortened, and the productivity improves.
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Inventors:
MORI HIDEMI
Application Number:
JP23967384A
Publication Date:
June 05, 1986
Filing Date:
November 14, 1984
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B29C45/02; B29C45/14; B29C45/73; H01L21/56; B29K101/10; B29L31/34; (IPC1-7): B29C45/02; B29C45/14; B29C45/73; B29K101/10; B29L31/34
Attorney, Agent or Firm:
Kiyoshi Inomata