Title:
RESIN SEALING MOLD FOR ELECTRONIC PART
Document Type and Number:
Japanese Patent JPH06254910
Kind Code:
A
Abstract:
PURPOSE: To provide a resin sealing mold for an electronic part in which a cavity of other shape can be formed easily.
CONSTITUTION: In a resin sealing mold 1 consisting of a top force 10 and a bottom force 20 provided with center blocks 11 and 12 into which resin is fed and cavity blocks 12 and 22 with cavities 13 and 23 into which resin is injected from the center blocks 11 and 12 through runners assembled respectively in the top force and the bottom force, the cavity blocks 12 and 22 are assembled removably to the center blocks 11 and 21 disposed on the top force 10 and the bottom force 20. Even when the cavity blocks 12 and 22 are formed on both sides of the center blocks 11 and 21, the respective cavity blocks are assembled removably.
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Inventors:
NAKANO SEIJI
KAMIYA TOSHIO
KAMIYA TOSHIO
Application Number:
JP6616993A
Publication Date:
September 13, 1994
Filing Date:
March 01, 1993
Export Citation:
Assignee:
SONY CORP
International Classes:
B29C33/76; B29C45/02; B29C45/14; B29C45/26; B29C45/33; H01L21/56; B29L31/34; (IPC1-7): B29C45/26; B29C33/76; B29C45/02; B29C45/14; B29C45/33; H01L21/56
Attorney, Agent or Firm:
Kuninori Funabashi
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