Title:
RESIN SHEET AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2017048392
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin sheet which can improve balance of implantation for lower circuits and adhesion for electronic parts.SOLUTION: A resin sheet 10 is used to bond electronic parts together, and tacking power at 25°C is 80 gf/5 mmφ or more. When measured for the resin sheet under a condition that frequency is 62.83 rad/sec and a measuring temperature range is 50-200°C by using a dynamic viscoelasticity measuring apparatus, the minimum melt viscosity of the resin sheet is 300 Pa s or more and 2000 Pa s or less.SELECTED DRAWING: Figure 1
Inventors:
SATO KOJI
Application Number:
JP2016172219A
Publication Date:
March 09, 2017
Filing Date:
September 02, 2016
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C09J7/00; C09J11/04; C09J163/00; C09J179/04; C09J201/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi