Title:
樹脂シート、および樹脂シートの製造方法
Document Type and Number:
Japanese Patent JP6665403
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin sheet which improves thermal conductivity of a molding obtained by molding a resin sheet that is applicable to various applications such as electrical and electronic applications and automobile application.SOLUTION: A resin sheet 10 contains: a binder resin A; a fibrous filler B having an aspect ratio of 100 or more; and a filler C having an aspect ratio smaller than that of the fibrous filler B. The fibrous filler B is arrayed in a plane direction. The filler C is milled fiber or granule having an aspect ratio of 50 or less. The fibrous filler (B) is a chopped fiber. A thermal conductivity in a plane direction of a molding obtained by heat-treating the resin sheet for 10 minutes on conditions of at pressure of 300 kg/cmand temperature of 180°C is 60 W/mK or more, and a ratio λ/λbetween thermal conductivity λin the plane direction and thermal conductivity λin the thickness direction is 3.0×10to 8.0×10.SELECTED DRAWING: Figure 1
Inventors:
Ryosuke Sugino
Application Number:
JP2015004185A
Publication Date:
March 13, 2020
Filing Date:
January 13, 2015
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
D21H13/50; D04H1/4242
Domestic Patent References:
| JP2014109024A | ||||
| JP2014088020A | ||||
| JP11035704A | ||||
| JP2013080590A | ||||
| JP2005297547A |
Attorney, Agent or Firm:
Shinji Hayami