To provide a resin sheet for sealing semiconductor excellent in handleability and moldability, and to provide a resin-sealed semiconductor device which produces little warpage and is highly reliable.
A resin sheet for sealing semiconductor includes (A) a biphenyl type epoxy resin, (B) a bisphenol A type epoxy resin which has a flexible skeleton and polar skeleton, (C) a phenolic resin curing agent, (D) a curing accelerator, and (E) silica powder, as indispensable components, wherein 10-100 pts.mass of component (B) based on 100 pts.mass of component (A) are contained; based on [(a)+(b)]/(c)=0.5-1.5, the ratio of the total number of (a) and (b) to (c) (wherein, (a) is the number of epoxy groups in component (A), (b) is the number of epoxy groups in component (B), and (c) is the number of phenolic hydroxyl in component (C)), 0.1-5 mass% of component (D) are contained in the epoxy resin composition, and 80 mass% or more and less than 94 mass% of component (E) is contained in the epoxy resin composition.
| WO/2002/060989 | GEL COAT COMPOSITION |
| WO/2004/104097 | EPOXY RESIN COMPOSITION |
| JP7025209 | Encapsulant for organic electroluminescence display elements |
ANDO MOTOTAKE
FUKUKAWA HIROSHI
