Title:
RESIN SOLUTION CONTAINING POLYAMIDE IMIDE AND METHOD FOR USING THE SAME
Document Type and Number:
Japanese Patent JP2018058966
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin solution containing polyamide which has high regularity of a molecular structure and has few branch structures, and a method (application) for using them.SOLUTION: There are provided a resin solution containing polyamide imide which has repeating units represented by formula (1); and a method (application) for using them. In formula (1), Rand Reach independently represent a divalent residue having an aromatic ring, an aliphatic ring or aliphatic hydrocarbon; Rand Reach independently represent a trivalent residue having an aromatic ring or an aliphatic ring; and hydrogen atoms bonded to each ring may be substituted with other atoms or atomic groups.SELECTED DRAWING: None
Inventors:
FUKUBAYASHI YUMETO
NAKAI MAKOTO
SHIGETA AKIRA
YAMADA MUNENORI
NAKAI MAKOTO
SHIGETA AKIRA
YAMADA MUNENORI
Application Number:
JP2016196412A
Publication Date:
April 12, 2018
Filing Date:
October 04, 2016
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
C08G73/14; C09D7/40; C09D11/102; C09D179/08; C09D201/00; C09J11/04; C09J179/08; C09J201/00
Domestic Patent References:
| JPH09302092A | 1997-11-25 | |||
| JP2015074778A | 2015-04-20 | |||
| JP2014156545A | 2014-08-28 |
Foreign References:
| US5955568A | 1999-09-21 |
Attorney, Agent or Firm:
Samejima Mutsumi
Kitahara Yasuhiro
Kitahara Yasuhiro