Title:
RESIN STRUCTURE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING RESIN STRUCTURE
Document Type and Number:
Japanese Patent JP2018063900
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin structure having a built-in switch that contributes to a reduction in size and thickness of an electronic apparatus while ensuring operational feeling of the switch.SOLUTION: A resin structure 1 comprises: a resin molding 420; and a push type switch 100. The push type switch 100 includes: a base part 130 to which a first terminal 110 and a second terminal 111 connected to an electric circuit are fixed; a button part 160 that projects from the base part 130; and a contact spring part 150 that is configured to be movable together with the button part 160, electrically connects the first terminal 110 and second terminal 111, and generates repulsive force against pressing force 400 applied between the base part 130 and button part 160. The base part 130 accommodates the button part 160 and contact spring part 150. In the push type switch 100, the base part 130 is embedded in the resin molding 420 while the button part 160 is exposed from the resin molding 420.SELECTED DRAWING: Figure 2
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Inventors:
KAWAI WAKAHIRO
Application Number:
JP2016202421A
Publication Date:
April 19, 2018
Filing Date:
October 14, 2016
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
H01H9/02; H01H11/00; H01H13/04; H01H21/00
Attorney, Agent or Firm:
Fukami patent office