Title:
RESIN SUBSTRATE FOR PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME, AND MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2021093416
Kind Code:
A
Abstract:
To provide a resin substrate for a printed wiring board, which is constituted to easily continue to operate even when vibrated.SOLUTION: A resin substrate 10 for a printed wiring board includes a plate-like insulating resin portion 4 having front and back sides, and a reinforcing member 5 that is embedded in the insulating resin portion 4. The reinforcing member 5 includes a plurality of annular portions 6. Each of the plurality of annular portions 6 has an annular shape. Each of the plurality of annular portions 6 is formed from a glass fiber.SELECTED DRAWING: Figure 1
Inventors:
TANAKA KATSUNORI
Application Number:
JP2019222012A
Publication Date:
June 17, 2021
Filing Date:
December 09, 2019
Export Citation:
Assignee:
TOYOTA IND CORP
International Classes:
H05K1/03; B32B17/04; D04C1/06; H05K1/02; H05K3/46
Attorney, Agent or Firm:
Fukami patent office