Title:
RESIN SUPPLY DEVICE, RESIN SEAL DEVICE AND MANUFACTURING METHOD OF RESIN SEALED ARTICLE
Document Type and Number:
Japanese Patent JP2022080083
Kind Code:
A
Abstract:
To provide a resin supply device, a resin seal device and a manufacturing method of a resin sealed article, capable of preventing defects from occurring.SOLUTION: A resin supply device (100) includes: a calculation part (130) configured to calculate a resin supply pattern according to a shape of a mold cavity (201) of a resin seal mold tool (200); and a supply part (120) configured to supply resin onto a coating target according to the resin supply pattern. The resin supply pattern has a plurality of linear paths (14). One linear path of neighboring linear paths is tilted to a symmetric axis (SM) that divides the mold cavity (201) in line symmetry. The other linear path of the neighboring linear paths is tilted to the one linear path. A region (19) between the neighboring linear paths is open to an outside of the coating target on a side where at least the other linear path is alienated from the one linear path.SELECTED DRAWING: Figure 2
Inventors:
KAWAGUCHI MAKOTO
FUJISAWA MASAHIKO
MURAMATSU YOSHIKAZU
HANAZATO MINORU
FUJISAWA MASAHIKO
MURAMATSU YOSHIKAZU
HANAZATO MINORU
Application Number:
JP2020191055A
Publication Date:
May 27, 2022
Filing Date:
November 17, 2020
Export Citation:
Assignee:
APIC YAMADA CORP
International Classes:
B29C43/34; B29C31/04; B29C43/18; H01L21/56
Domestic Patent References:
| JP2018134846A | 2018-08-30 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Koichi Sawai
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Koichi Sawai
Previous Patent: JPWO2022080082
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