To provide a resin wiring board which can realize thin, compact, and highly reliable semiconductor device using a thin resin board, wherein warpage can be made small even when a wiring pattern of different shape is prepared in both sides.
The resin wiring board includes a flat plate-like resin board 12, a semiconductor element mounting region 30 prepared on one side of the resin board 12, an element connection terminal 14 arranged inside or on the periphery of the semiconductor element mounting region 30, an external connection terminal 16 which is electrically connected with this element connection terminal 14 and arranged in another plane of the resin board 12, a first resin film 26 formed into a shape so as to expose the external connection terminal 14 in one side of the plane, a second resin film 28 formed into a shape so as to expose the external connection terminal 16 in another side of the plane, wherein the first resin film 26 and the second resin film 28 differ in at least one of glass transition point, hardening contraction rate, and thermal expansion coefficient.
NANO MASANORI
FUKUDA TOSHIYUKI
| JPH10242326A | 1998-09-11 | |||
| JP2006237324A | 2006-09-07 | |||
| JP2001217514A | 2001-08-10 | |||
| JP2003318361A | 2003-11-07 |
Yoshihiro Morimoto
Toshiji Sasahara
Yohei Harada