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Title:
RESINOID BONDED GRINDING WHEEL
Document Type and Number:
Japanese Patent JP2001038638
Kind Code:
A
Abstract:

To suppress the friction heat during the grinding, to improve the strength and hardness of a abrasive grain layer, and to prevent the loss in shape.

In this grinding wheel, superfine abrasive grains 13 are diffused in a binder phase 12 of a phenol resin. Fillers 14 containing both solid lubricants of CaF2 15 and ZnO 16 by 3-50 vol.% of the resin binder phase are diffused. ZnO 16 is contained by 10-40 vol.% of the total amount of the tillers while 15 vol.% of CaF2. When ZnO is contained less than 10 vol.%, the strength and hardness of the abrasive grain layer are small, the shape is lost, and the suppressive effect cannot be obtained. When ZnO is contained more than 40 vol.%, the strength and hardness are too large, the grinding resistance is increased, and the friction heat in the abrasive grain layer is increased. ZnO 16 is diffused in the resin binder phase 12 in a condition of the secondary particles in which multi-crystal primary particles are aggregated.


Inventors:
TAKANO TOSHIYUKI
TAKAHASHI TSUTOMU
Application Number:
JP21138899A
Publication Date:
February 13, 2001
Filing Date:
July 26, 1999
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B24D3/28; B24D3/00; B24D3/02; (IPC1-7): B24D3/28; B24D3/00; B24D3/02
Attorney, Agent or Firm:
Masatake Shiga (8 outside)