PURPOSE: To improve heat radiation performance and prevent deterioration of bond due to generated heat and improve the grinding ratio by applying special plating onto the cubic system boron nitride (CBN) grinding grains and using the combination of thermosetting resin, solid lubricating agent, and metal powder in a specific rate, for bond layer.
CONSTITUTION: The CBN grinding grain having a diameter of 10W300μm can be used, and Ni-plating is carried-out, since grinding ratio can be increased and the close adhesion performance to grinding grain can be improved, and corrosion- proofness can be improved, and further Co-plating is applied for an intermediate layer, and finally Ni- plating is applied for an outer layer. The amount of grinding grains is 10W50vol%. Phenol resin, epoxy resin, etc. can be used, and the amount is preferably 25W60vol%. MoS2, hexagonal system BN, etc. can be used as solid lubricating agent, and heat generation is prevented by reducing the friction between a material to be ground and a grindstone, and the amount is preferably 10W25vol%. Metal powder is to have the high thermal conductivity, such as AG, Cu, etc., and the amount is preferably 7W 15vol%. These substances are mixed uniformly, and molded by using a mold, and hardended by heating. Thus, a CBN resinoid grindstone having a specially high grinding ratio can be obtained.
SENDA KIYOUICHI
KASAHARA MAKOTO
SUGANO KATSUO
