To provide a resist film applying apparatus employing a spray resist method which highly accurately deposits an electrodeposited resist film having uniform film thickness.

The apparatus is provided with a two-fluid nozzle (82) for mixing a resist agent and a carrier gas to spray the resist agent in an atomized state, a resist container (80) which is provided with the two-fluid nozzle at a prescribed height position and causes resist particles having larger weight in the resist particles sprayed from the two-fluid nozzle to fall down, a discharge port (81) which is provided above the height position of the two-fluid nozzle and discharges the resist particles having a lighter weight in the resist particles together with the carrier gas and adjusting parts (87-89) for adjusting the height of the discharge port in the height from the height position of the two-fluid nozzle to the top of the resist container.