Title:
RESIST APPLYING DEVICE
Document Type and Number:
Japanese Patent JPH0677121
Kind Code:
A
Abstract:
PURPOSE: To provide a resist applying device which can prevent re-sticking of resist to a wafer surface.
CONSTITUTION: A guide member 15 is attached to the inner surface of a side wall 13a of a cup 13. A long and narrow guard plate 17 is slidably engaged with the guide member 15. Further, both ends of the guard plate 17 are drawn out to the outside of the cup 13 through an opening 16 that is formed in the side wall 13a of the cup 13. By sliding the guard plate 17 through the opening 16 while engaging it with the guide member 15, the surface of the guard plate 17 that face the periphery of a wafer 12 can be kept clean.
Inventors:
YOKOYAMA TAKASHI
Application Number:
JP8197493A
Publication Date:
March 18, 1994
Filing Date:
April 08, 1993
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
B05C11/08; G03F7/16; H01L21/027; (IPC1-7): H01L21/027; B05C11/08; G03F7/16
Attorney, Agent or Firm:
Toshiaki Suzuki
Next Patent: PIPING FOR CHEMICALS AND CHEMICALS SUPPLYING DEVICE