Title:
RESIST COMPOSITION FOR CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3115449
Kind Code:
B2
Abstract:
PURPOSE: To obtain a resist compsn. for a circuit board excellent in heat resistance and well proof against a hot high alkali bath of > pH14 at 80°C without deteriorating photosensitive characteristics.
CONSTITUTION: Resin contg. uncured novolak type epoxy resin partially having acrylic modified epoxy groups is used as the resin component of a photosensitive resin matrix and an imidazole curing agent is added to obtain the objective resist compsn. for a circuit board giving a cured resist having ≤0.1% rate of water absorption. When this resist compsn. is used, a printed circuit board excellent in reliability can easily be obtd. even in the case of a fine pattern.
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Inventors:
Masato Kawade
Motoo Asai
Motoo Asai
Application Number:
JP10640693A
Publication Date:
December 04, 2000
Filing Date:
May 07, 1993
Export Citation:
Assignee:
IBIDEN Co., Ltd.
International Classes:
C08F290/00; C08G59/17; C08G59/20; G03F7/004; G03F7/027; C08F299/02; G03F7/032; G03F7/038; H05K1/03; H05K3/18; (IPC1-7): G03F7/027; C08G59/20; G03F7/038; H05K3/18
Domestic Patent References:
| JP61291646A | ||||
| JP1197744A | ||||
| JP2223954A | ||||
| JP521932A | ||||
| JP5194686A | ||||
| JP5273755A |
Attorney, Agent or Firm:
Junzo Ogawa (1 person outside)