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Title:
RESIST COMPOSITION FOR LIQUID IMMERSION EXPOSURE AND PATTERN FORMING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2010002909
Kind Code:
A
Abstract:

To provide a resist composition for liquid immersion exposure improved in mask shape reproducibility, pattern falling and exposure latitude and excellent in property of following an immersion liquid when applied to liquid immersion exposure, and to provide a pattern forming method using the same.

The resist composition for liquid immersion exposure includes (A) a resin whose solubility to an alkaline developer is increased by the action of an acid, (B) a photoacid generator, and (C) a specific mixed solvent. The pattern forming method uses this resist composition.


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Inventors:
INABE HARUKI
KANNA SHINICHI
TAKAHASHI AKIRA
KANDA HIROMI
Application Number:
JP2009159317A
Publication Date:
January 07, 2010
Filing Date:
July 03, 2009
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/004; C08F216/14; C08F220/06; C08F220/28; C08F222/06; C08F232/04; C08F234/02; G03F7/039; G03F7/38; H01L21/027
Domestic Patent References:
JP2003255542A2003-09-10
JP2003147023A2003-05-21
JP2003215806A2003-07-30
JP2003122018A2003-04-25
JP2003337419A2003-11-28
JP2003337416A2003-11-28
JP2003255539A2003-09-10
JP2003255542A2003-09-10
JP2003147023A2003-05-21
Attorney, Agent or Firm:
Takeshi Takamatsu
Kiyozumi Yazawa



 
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