Title:
RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
Japanese Patent JP2013080109
Kind Code:
A
Abstract:
To provide a resist composition excellent in lithography characteristics and pattern shape and to provide a method for forming a resist pattern.
A resist composition includes: a base component (A) generating an acid by exposure in which a solubility of the base component in a developer is changed by an action of an acid; an acid generator component (C) generating an acid having a pKa of 0 or more by exposure (excluding the base component (A)); and an acid generator component (B) generating an acid by exposure (excluding the base component (A) and the acid generator component (C)), where the base component (A) contains a polymer (A1) having an anion moiety generating an acid by exposure on at least one terminal of the main chain.
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Inventors:
UTSUMI YOSHIYUKI
DAZAI NAOHIRO
DAZAI NAOHIRO
Application Number:
JP2011220101A
Publication Date:
May 02, 2013
Filing Date:
October 04, 2011
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/004; C07C61/135; C07C65/10; C07C309/12; C07C311/04; C07C381/12; G03F7/039; H01L21/027
Domestic Patent References:
JP2013057836A | 2013-03-28 |
Foreign References:
WO2011070947A1 | 2011-06-16 |
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Suzuki Mitsuyoshi
Mitsunaga Igarashi
Masatake Shiga
Suzuki Mitsuyoshi
Mitsunaga Igarashi
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