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Patent Searching and Data


Title:
RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN AND POLYMERIC COMPOUND
Document Type and Number:
Japanese Patent JP2019020487
Kind Code:
A
Abstract:
To provide a resist composition and a method for forming a resist pattern achieving improvement in resolution, particularly in electron beam or EUV lithography.SOLUTION: The resist composition generates an acid by exposure and shows changes in the solubility with a developer by an action of an acid, and the composition comprises a polymeric compound (A1) having a structural unit (a0) derived from a compound represented by general formula (a0-1) below and a structural unit (a10) derived from a compound represented by general formula (a10-1) below, and having no structural unit represented by general formula (1). In the formulae, Raand Rarepresent a polymerizable group-containing group; Waand Warepresent an aromatic hydrocarbon group having a valence of (n+1) or (n+1); nand nrepresent an integer of 1 to 3; and Zrepresents Fe, Co, Ni, Cr or Ru.SELECTED DRAWING: None

Inventors:
山崎 広人
矢萩 真人
鈴木 健太
Application Number:
JP2017136603A
Publication Date:
February 07, 2019
Filing Date:
July 12, 2017
Export Citation:
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Assignee:
東京応化工業株式会社
International Classes:
G03F7/038; C08F212/00; C08F220/30; C08F232/08; G03F7/20
Attorney, Agent or Firm:
棚井 澄雄
志賀 正武
松本 将尚
宮本 龍
飯田 雅人