Title:
RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN AND POLYMERIC COMPOUND
Document Type and Number:
Japanese Patent JP2019020487
Kind Code:
A
Abstract:
To provide a resist composition and a method for forming a resist pattern achieving improvement in resolution, particularly in electron beam or EUV lithography.SOLUTION: The resist composition generates an acid by exposure and shows changes in the solubility with a developer by an action of an acid, and the composition comprises a polymeric compound (A1) having a structural unit (a0) derived from a compound represented by general formula (a0-1) below and a structural unit (a10) derived from a compound represented by general formula (a10-1) below, and having no structural unit represented by general formula (1). In the formulae, Raand Rarepresent a polymerizable group-containing group; Waand Warepresent an aromatic hydrocarbon group having a valence of (n+1) or (n+1); nand nrepresent an integer of 1 to 3; and Zrepresents Fe, Co, Ni, Cr or Ru.SELECTED DRAWING: None
Inventors:
YAMAZAKI HIROTO
YAHAGI MASATO
SUZUKI KENTA
YAHAGI MASATO
SUZUKI KENTA
Application Number:
JP2017136603A
Publication Date:
February 07, 2019
Filing Date:
July 12, 2017
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/038; C08F212/00; C08F220/30; C08F232/08; G03F7/20
Domestic Patent References:
| JPH09179292A | 1997-07-11 | |||
| JP2010061097A | 2010-03-18 | |||
| JP2014024999A | 2014-02-06 | |||
| JP2001051407A | 2001-02-23 |
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida