Title:
RESIST COMPOSITION FOR NEGATIVE TYPE DEVELOPMENT, AND PATTERN FORMING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2009258586
Kind Code:
A
Abstract:
To provide a resist composition for negative type development superior in pattern collapse performance and trench pattern resolution in patterning with negative type development in order to stably form a highly precise fine pattern for manufacturing a highly integrated and highly precise electronic device, and to provide a pattern forming method using the same.
The resist composition for negative type development contains (A) a resin for reducing solubility to a negative type developer due to action of acid by including an acid decomposition repeating unit of a specific structure, (B) a photoacid generator, and (C) a solvent. The pattern forming method using it is also provided.
Inventors:
TSUBAKI HIDEAKI
Application Number:
JP2008200248A
Publication Date:
November 05, 2009
Filing Date:
August 01, 2008
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
G03F7/038; C08F32/04; G03F7/039; G03F7/32; H01L21/027
Domestic Patent References:
JP2003302762A | 2003-10-24 | |||
JP2002525683A | 2002-08-13 | |||
JP2007511785A | 2007-05-10 | |||
JP2000199953A | 2000-07-18 | |||
JP2003302762A | 2003-10-24 |
Foreign References:
WO2004078688A1 | 2004-09-16 | |||
WO2004078688A1 | 2004-09-16 |
Attorney, Agent or Firm:
Takeshi Takamatsu
Kiyozumi Yazawa
Kiyozumi Yazawa
Previous Patent: JP2009258585
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