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Title:
RESIST COMPOSITION FOR NEGATIVE TYPE DEVELOPMENT, AND PATTERN FORMING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2009258586
Kind Code:
A
Abstract:

To provide a resist composition for negative type development superior in pattern collapse performance and trench pattern resolution in patterning with negative type development in order to stably form a highly precise fine pattern for manufacturing a highly integrated and highly precise electronic device, and to provide a pattern forming method using the same.

The resist composition for negative type development contains (A) a resin for reducing solubility to a negative type developer due to action of acid by including an acid decomposition repeating unit of a specific structure, (B) a photoacid generator, and (C) a solvent. The pattern forming method using it is also provided.


Inventors:
TSUBAKI HIDEAKI
Application Number:
JP2008200248A
Publication Date:
November 05, 2009
Filing Date:
August 01, 2008
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/038; C08F32/04; G03F7/039; G03F7/32; H01L21/027
Domestic Patent References:
JP2003302762A2003-10-24
JP2002525683A2002-08-13
JP2007511785A2007-05-10
JP2000199953A2000-07-18
JP2003302762A2003-10-24
Foreign References:
WO2004078688A12004-09-16
WO2004078688A12004-09-16
Attorney, Agent or Firm:
Takeshi Takamatsu
Kiyozumi Yazawa