Title:
RESIST COMPOSITION AND PATTERNING PROCESS
Document Type and Number:
Japanese Patent JP2009098638
Kind Code:
A
Abstract:
To provide a resist composition preventing degradation of a pattern profile.
A resist composition comprises a polymer compound as base resin which improves or reduces its alkali solubility under the action of an acid, and a polymer compound as an additive copolymer comprising recurring units (a) and (b) of the general formula (1). A resist film formed by using this resist composition has good barrier property against water, so that leaching of the resist film with water is suppressed and a change of pattern profile due to leach-out is reduced.
Inventors:
HATAKEYAMA JUN
HASEGAWA KOJI
WATANABE TAKESHI
HARADA YUJI
HASEGAWA KOJI
WATANABE TAKESHI
HARADA YUJI
Application Number:
JP2008225761A
Publication Date:
May 07, 2009
Filing Date:
September 03, 2008
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
G03F7/004; C08F220/28; C08F232/00; G03F7/038; G03F7/039; G03F7/38; H01L21/027
Domestic Patent References:
| JP2007219471A | 2007-08-30 | |||
| JP2007233322A | 2007-09-13 |
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa