Title:
RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP2022190812
Kind Code:
A
Abstract:
To provide a resist composition which achieves higher sensitivity, suppresses film thickness loss, and is excellent in roughness reduction, and a resist pattern forming method using the resist composition.SOLUTION: The resist composition contains: a resin component which has a constituent unit (a01) having a polycyclic lactone-containing cyclic group and a constituent unit (a02) represented by general formula (a0-2); and a compound (B0) represented by general formula (b0). In the formulae, Ra05-Ra08 each independently represent a hydrogen atom or the like; X0 represents a bromine atom or an iodine atom; Rm represents a hydroxy group or the like; 1≤nb1+nb2≤5; Yb0 represents a divalent linking group or a single bond; Vb0 represents a single bond or the like; R0 represents a hydrogen atom or the like; Mm+ represents an m-valent organic cation; and m represents an integer of 1 or more.SELECTED DRAWING: None
Inventors:
UEHARA TAKUYA
MATSUSHITA TETSUYA
MIYAGAWA JUNICHI
MATSUSHITA TETSUYA
MIYAGAWA JUNICHI
Application Number:
JP2021099259A
Publication Date:
December 27, 2022
Filing Date:
June 15, 2021
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/039; G03F7/004; G03F7/20
Attorney, Agent or Firm:
田▲崎▼ 聡
Ryu Miyamoto
Emi Hattori
Takuya Shiraishi
Ryu Miyamoto
Emi Hattori
Takuya Shiraishi