Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIST PATTERN FORMING METHOD AND METHOD FOR PRODUCING CIRCUIT ELEMENT
Document Type and Number:
Japanese Patent JP2005309141
Kind Code:
A
Abstract:

To provide a resist pattern forming method by which control of the dimensions of a resist pattern can be accurately performed and LER can be diminished.

The resist pattern forming method includes the steps of applying a radiation to predetermined positions of a radiation sensitive resin composition on a substrate with the radiation sensitive resin composition containing a siloxane resin having a structural unit represented by formula (I) and a weight average molecular weight, in terms of polystyrene, by GPC of 500-1,000,000 and a radiation sensitive acid generator; developing the composition with an alkaline developer; applying a radiation; and carrying out heating. In the formula (I), R denotes a 1-20C linear or branched hydrocarbon group whose valence is n+1 or a 3-20C alicyclic hydrocarbon group whose valence is n+1, the linear or branched hydrocarbon group and the alicyclic hydrocarbon group each may be substituted; X denotes a group containing an acid-dissociable group; and n is 1 or 2.


Inventors:
NISHIMURA ISAO
SHIMOKAWA TSUTOMU
EGAWA HIROMI
Application Number:
JP2004126805A
Publication Date:
November 04, 2005
Filing Date:
April 22, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JSR CORP
International Classes:
G03F7/075; C08G77/14; G03F7/039; G03F7/11; G03F7/38; G03F7/40; H01L21/027; (IPC1-7): G03F7/075; C08G77/14; G03F7/039; G03F7/11; G03F7/38; G03F7/40; H01L21/027
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Takeshi Higuchi