Title:
レジストパターン形成方法及び感放射線性樹脂組成物
Document Type and Number:
Japanese Patent JP5263453
Kind Code:
B2
Abstract:
A resist pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed with a developer solution including no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a base polymer, a fluorine-atom-containing polymer, a radiation-sensitive acid generator, a solvent, and a compound. The base polymer has an acid-labile group. The fluorine-atom-containing polymer has a content of fluorine atoms higher than a content of fluorine atoms of the base polymer. The compound has a relative permittivity greater than a relative permittivity of the solvent by at least 15. A content of the compound is no less than 10 parts by mass and no greater than 200 parts by mass with respect to 100 parts by mass of the base polymer.
Inventors:
Watoshi Ito
Hirokazu Sakakibara
Masashi Hori
Taiichi Furukawa
Hirokazu Sakakibara
Masashi Hori
Taiichi Furukawa
Application Number:
JP2012518672A
Publication Date:
August 14, 2013
Filing Date:
October 11, 2011
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
G03F7/004; G03F7/038; G03F7/039; G03F7/32; H01L21/027
Domestic Patent References:
| JP2010020284A | 2010-01-28 | |||
| JP2009244780A | 2009-10-22 | |||
| JP2005221721A | 2005-08-18 | |||
| JP2009025723A | 2009-02-05 | |||
| JP2010197619A | 2010-09-09 | |||
| JP2010197619A | 2010-09-09 | |||
| JP2010134106A | 2010-06-17 | |||
| JP2010020284A | 2010-01-28 | |||
| JP2009244780A | 2009-10-22 | |||
| JP2005221721A | 2005-08-18 | |||
| JP2009025723A | 2009-02-05 |
Attorney, Agent or Firm:
Hajime Amano