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Patent Searching and Data


Title:
RESIST PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP63214742
Kind Code:
A
Abstract:

PURPOSE: To enable development immediately after exposure without carrying out a stage for removing a CEL film and to increase the stability when a resist pattern is formed, by using a photosensitive layer contg. a specified compd.

CONSTITUTION: A resist layer is selectively exposed through a photosensitive layer for increasing the contrast of light incident on the resist layer, and the resist layer is developed together with the photosensitive layer to form a resist pattern. At this time, a photosensitive layer contg. 7,8,13,14-tetrahydroabietic acid or hydrogenated rosin contg. the acid as the principal component by ≥50% is used. Since 7,8,13,14-tetrahydroabietic acid selected as a CEL film forming material among nonpolar org. materials and materials soluble in an aq. alkali soln. is dissolved in an ordinary developer for a positive type resist, the photosensitive layer is removed during development. Rosin increases its stability by hydrogenation and the stability as a soln. in a nonpolar solvent is increased.


Inventors:
Umibe, Katsuaki
Kosuge, Maki
Yamashita, Yoshio
Asano, Takateru
Kobayashi, Kenji
Application Number:
JP1987000047806
Publication Date:
September 07, 1988
Filing Date:
March 04, 1987
Export Citation:
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Assignee:
OKI ELECTRIC IND CO LTD
FUJI YAKUHIN KOGYO KK
International Classes:
H01L21/027; G03C1/00; G03F7/00; G03F7/004; G03F7/09; G03F7/095; G03F7/26; G03F7/32; H01L21/30; (IPC1-7): G03C1/00; G03F7/00; H01L21/30