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Title:
RESIST PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JPH01149044
Kind Code:
A
Abstract:
PURPOSE:To obtain a good shaped resist pattern having with a vertical corner part by applying a resist on a substrate, and then a water soluble substance contg. a heat absorbing material on the obtd. substrate, and then removing the water soluble substance from the substrate, after heating the water soluble substance, followed by exposing and developing the obtd. substrate. CONSTITUTION:A thermal oxidation film 12 is formed on a silicon substrate 11, and the resist 13 is applied on the obtd. substrate, and a mixture 14 of pullulan and polyvinyl pyrrolidone contg. carbon is applied on the obtd. substrate. Next, the surface temp. of a mixture layer 14 is controlled so as to be 100-150 deg.C by projecting infra-red rays. Thus, as only the surface part of the resist 13 is thermally treated, the hardness of the resist against the development increases. Next, the mixture layer 14 is removed by washing, and the exposed resist 13 is exposed and developed. As the resist 13 is in such a state that only the surface part of the resist is increased in hardness, when the resist is developed after exposing, the vertical corner part of the resist pattern is obtd., and the inner layer part of the resist is removed at a sitting by developing the resist pattern for a short period. At this time, good shaped the resist pattern 13a having the vertical corner part is obtd. without having its vertical corner part of the pattern disintegrated.

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Inventors:
TANAKA HIROYUKI
KIMURA YASUKI
Application Number:
JP30740387A
Publication Date:
June 12, 1989
Filing Date:
December 07, 1987
Export Citation:
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Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
G03F7/38; G03F7/00; G03F7/11; G03F7/20; H01L21/027; (IPC1-7): G03C1/00; G03C5/00; G03F7/00; H01L21/30
Attorney, Agent or Firm:
Hiroshi Kikuchi



 
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