Title:
レジスト剥離剤組成物
Document Type and Number:
Japanese Patent JP4440689
Kind Code:
B2
Abstract:
(Problem) It is to provide a stripper having excellent ability to suppress corrosion or damage to the copper wiring or the low-k film, and having excellent photoresist residue removability after ashing. (Solution) The invention provides a photoresist stripper composition characterized in containing salts of at least two different inorganic acids, surfactants and a corrosion inhibitor for metal, and having a pH in the range of 3-10; and a process for preparation of semiconductor devices characterized in that the photoresist residues generated during the preparation of semiconductor devices which employs copper or a copper-dominant alloy as the material for wiring is stripped using said photoresist stripper.
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Inventors:
Masayuki Takashima
Application Number:
JP2004104341A
Publication Date:
March 24, 2010
Filing Date:
March 31, 2004
Export Citation:
Assignee:
Dongwoo Fine-Chem Co.,Ltd.
International Classes:
G03F7/42; G03C5/00; H01L21/027; H01L21/304
Domestic Patent References:
| JP7297158A | ||||
| JP2002099100A | ||||
| JP2003005384A | ||||
| JP2001242641A | ||||
| JP11316464A | ||||
| JP2005150236A | ||||
| JP2003209094A | ||||
| JP2001330970A | ||||
| JP2001226696A | ||||
| JP2001007071A |
Attorney, Agent or Firm:
Aoyama Aoi
Yasuo Shibata
Kenichi Morizumi
Yasuo Shibata
Kenichi Morizumi