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Patent Searching and Data


Title:
RESIST REMOVING AGENT COMPOSITION FOR LIFT-OFF
Document Type and Number:
Japanese Patent JP2006201332
Kind Code:
A
Abstract:

To provide a resist removing agent for lift-off which can peel off and remove an overhanging resist pattern on a substrate in a short time, and which does not corrode a metal film and a method for manufacturing an electronic device using the same.

The resist removing agent composition for lift-off consists of 25-75 wt.% of specific glycol monoalkyl ether and 75-25 wt.% of another organic solvent that is liquid at 23°C in the atmospheric pressure. The method for manufacturing the electronic device includes steps of: forming a resist film of a negative type photoresist composition on the substrate; obtaining the substrate having the resist pattern by exposing the resist film in the pattern and developing it; forming the metal film on the substrate having the resist pattern; and removing the resist pattern from the substrate using the removing agent composition.


Inventors:
ABE NOBUNORI
YAMABE AKIRA
FUJINO TAKEO
Application Number:
JP2005011242A
Publication Date:
August 03, 2006
Filing Date:
January 19, 2005
Export Citation:
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Assignee:
NIPPON ZEON CO
International Classes:
G03F7/42; H01L21/027; H01L21/304