To provide a resist solution application processing apparatus capable of removing contact transfer unevenness which may be generated by contact between the rear face of a substrate and the other member and drying unevenness.
The resist solution application processing apparatus is provided with a reduced-pressure dryer 14 for performing the reduced-pressure drying of a substrate 100 to which a resist solution is applied, a baking device 16 for heating the substrate 100 dried in a reduced-pressure state to solidify the resist solution and a carrying robot 15 for carrying the substrate 100 between the reduced-pressure dryer 14 and the baking device 16. In the carrying robot 15, a carrying band 21 for supporting the substrate 100 in a state of mounting the substrate 100 from the lower side is constituted by laminating a band body 24, an adiabatic part 23 for insulating heat between the substrate 100 and the band body 24 and a band surface 22 composed of a material having heat conductivity higher than that of the adiabatic part 23 and having projections P supporting the substrate 100.
KONDO NAOKI
SAWADA HIDEYUKI
MIMURA FUMIAKI
HIDA MITSUHIRO
Mitsuo Tanaka
Atsushi Maeda
Next Patent: TRANSFORMER AND RESONANCE TYPE SWITCHING POWER SUPPLY USING THE SAME