PURPOSE: To enable wafer transfer of a path through without mounting a material to be treated directly on a hot plate during heat treatment and to prevent over bake by floating the material to be treated from the hot plate by lowering the hot plate when loading and unloading the material to be treated to and from a heat treatment section.

CONSTITUTION: A resist treatment device which carries out heat-treatment during resist application and/or before and after development is provided with a mechanism which lowers a hot plate 7 when a material W to be treated is loaded and unloaded to and from a heat treatment section to float the material W from the hot plate 7 and raises the hot plate 7 during heat treatment for treatment. For example, a wafer W which is transferred mounted on a transfer belt 6 is transferred to over the hot plate 7 and the hot plate 7 is moved downward, and a plurality of pins 8 are raised to a place of 8' to support the wafer W temporarily and to move the transfer belt 6 right and left. The high temperature hot plate 7 rises to a place 7' to heat the wafer W. After heating, the hot plate 7 lowers to a place 7 and the pin 8' supports the wafer W.