Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIST UNDERLAY FILM-FORMING COMPOSITION, AND LITHOGRAPHY UNDERLAY FILM AND PATTERNING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2019113571
Kind Code:
A
Abstract:
To provide a resist underlay film-forming composition having excellent pattern rectangularity, a lithography underlay film, and a patterning method.SOLUTION: A resist underlay film-forming composition contains a compound containing tellurium or a resin containing tellurium, and a silicon-containing compound.SELECTED DRAWING: None

Inventors:
樋田 匠
牧野嶋 高史
佐藤 隆
越後 雅敏
Application Number:
JP2016091788A
Publication Date:
July 11, 2019
Filing Date:
April 28, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
三菱瓦斯化学株式会社
International Classes:
G03F7/11; C08G79/00; G03F7/20; G03F7/26
Attorney, Agent or Firm:
稲葉 良幸
大貫 敏史
内藤 和彦



 
Previous Patent: 電流検出器

Next Patent: 配光制御素子