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Patent Searching and Data


Title:
レジスト下層膜材料ならびにパターン形成方法
Document Type and Number:
Japanese Patent JP4069025
Kind Code:
B2
Abstract:
There is disclosed a resist lower layer film material for a multilayer-resist film used in lithography which contains a polymer having at least a repeating unit represented by the following general formula (1). There can be provided a resist lower layer film material for a multilayer-resist process, especially for a two-layer resist process, which functions as an excellent antireflection film especially for exposure with a short wavelength, namely has higher transparency, and has the optimal n value and k value, and is excellent in an etching resistance in substrate processing, and a method for forming a pattern on a substrate by lithography using it

Inventors:
Jun Hatakeyama
Hideto Kato
Application Number:
JP2003174020A
Publication Date:
March 26, 2008
Filing Date:
June 18, 2003
Export Citation:
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Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
G03F7/11; G03F7/004; G03F7/038; G03F7/075; G03F7/09; H01L21/027
Domestic Patent References:
JP2001056554A
JP8208812A
JP2001324798A
JP10282666A
JP2001022084A
JP2003149820A
JP10232490A
Attorney, Agent or Firm:
Mikio Yoshimiya